Technological Breakthrough | Hongsheng Machinery Successfully Develops 1.8m Ultra-High-Precision 7075 Semiconductor Cavity
Recently, Dalian Hongsheng Machinery Co., Ltd. has achieved a major technological breakthrough in the field of high-end precision semiconductor component processing. The company has successfully overcome the processing challenges of a 1.8-meter large-scale hollow semiconductor cavity made of 7075 aerospace-grade aluminum alloy. All core precision indicators meet international high-end semiconductor equipment standards, and the product has passed the rigorous inspection and acceptance of Japanese clients, proving the company’s advanced manufacturing capabilities in large ultra-precision semiconductor cavity production.
This custom cavity is a core component for high-end Japanese semiconductor equipment. With a height of 1.8 meters and a large-area hollow thin-wall structure, the workpiece features low rigidity and high deformation tendency, making it an extremely difficult processing project in the industry. Manufactured with 7075 aerospace aluminum, the material carries high internal stress and is prone to warping, deformation and tolerance deviation during large-scale machining. Unlike small-sized semiconductor cavities and machine tool cavities, it cannot be processed with conventional techniques, requiring customized manufacturing and professional stress control solutions.
To address the extreme precision requirements and structural processing difficulties, Hongsheng’s technical team developed a exclusive high-end manufacturing solution. We adopted a six-stage precision stress relief process to fundamentally eliminate deformation risks of large aluminum workpieces. Meanwhile, by applying gantry 5-axis and 4-axis linkage composite boring and milling technology, we realized integrated one-piece precision forming for large hollow cavities and completely solved the precision instability problem of large thin-wall structural parts.
Under strict precision control, all technical parameters of the finished product fully meet customer standards. The overall flatness is controlled within 8μm, the position tolerance of internal cylindrical structures reaches 0.01mm, and the roundness and cylindricity are stably controlled at 2μm. The milling surface roughness achieves Ra0.6 with seamless tool path processing and zero machining traces, reaching top-level standards in both geometric accuracy and surface quality.
Dalian Hongsheng Machinery has long focused on micron-level ultra-precision component processing, specializing in the R&D and manufacturing of high-difficulty parts for semiconductor equipment and precision testing instruments. This technological breakthrough fully demonstrates our outstanding strengths in large special-shaped component stress control, multi-axis linkage composite machining and ultra-high precision manufacturing.
In the future, Dalian Hongsheng Machinery will continue to deeply engage in high-end precision manufacturing, focusing on high-precision processing for semiconductor components, testing and measuring equipment parts, and industrial machine tool components. We will persist in technological iteration and process innovation, continuously break through the technical bottlenecks of processing large-sized, high-precision and easily deformable special-shaped parts, and optimize our integrated system of precision machining, stress relief and precision testing. Adhering to strict quality standards, mature process solutions and stable delivery capacity, we will keep tackling high-difficulty precision manufacturing challenges, provide high-quality, high-precision and high-stability core components for global high-end equipment industries, and contribute to the high-quality development of the precision manufacturing industry.
Technical Department, Dalian Hongsheng Machinery
